Title:
CORE SUBSTRATE AND INTERPOSER
Document Type and Number:
WIPO Patent Application WO/2022/163588
Kind Code:
A1
Abstract:
Provided is a core substrate (601) for constituting an interposer (700) on which a semiconductor element (811) is mounted, the core substrate (601) incorporating an inductor. The core substrate (601) comprises a ceramic substrate (100), a conductor portion (201), and a magnetic material portion (301). The ceramic substrate (100) has a first surface (SF1) and a second surface (SF2) opposite the first surface (SF1) in a thickness direction, and includes a through-hole (HL1) between the first surface (SF1) and the second surface (SF2). The conductor portion (201) extends through the through-hole (HL1). The magnetic material portion (301) surrounds the conductor portion (201) in the through-hole (HL1), and is made of ceramics. The conductor portion (201) is made of sintered metal.
Inventors:
WAKAZONO YOSHITSUGU (JP)
TANI MAKOTO (JP)
TANI MAKOTO (JP)
Application Number:
PCT/JP2022/002456
Publication Date:
August 04, 2022
Filing Date:
January 24, 2022
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2007129526A1 | 2007-11-15 |
Foreign References:
| JP2001060767A | 2001-03-06 | |||
| JP2013054369A | 2013-03-21 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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