Title:
CORELESS BOARD MANUFACTURING METHOD AND MANUFACTURING MEMBER, SUPPORT CARRIER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/128171
Kind Code:
A1
Abstract:
The present invention relates to a support carrier used for manufacturing a coreless board, comprising two laminated substrates, and semi-cured material layers located on the sides of the two substrates facing away from each other. The sides of the semi-cured material layers distant from the substrates are further provided with carrier copper foils. The support carrier further comprises multiple prebored holes penetrating through the two substrates at preset positions, and the prebored holes are filled with a semi-cured material in a pressing process of the support carrier. The radial size of the prebored holes is greater than the radial size of locating holes formed during lamination pressing of the coreless board. Since the prebored holes are filled with the semi-cured material, and the radial size of the prebored holes is greater than the radial size of the locating holes, the joint edges of the two substrates are wrapped by the semi-cured material in the subsequent process of forming the locating holes and are not eroded by a chemical liquid. Therefore, delamination of the substrates is avoided and the product quality is improved. Also provided are a coreless board manufacturing method, a coreless board manufacturing member, and a manufacturing method for a support carrier used for manufacturing a coreless board.
Inventors:
XIE TIANHUA (CN)
CUI YONGTAO (CN)
XU JUAN (CN)
CUI YONGTAO (CN)
XU JUAN (CN)
Application Number:
PCT/CN2018/093621
Publication Date:
July 04, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
International Classes:
H01L21/683
Foreign References:
| CN202183910U | 2012-04-04 | |||
| CN104538320A | 2015-04-22 | |||
| CN108172542A | 2018-06-15 | |||
| US20090229874A1 | 2009-09-17 | |||
| CN103987198A | 2014-08-13 | |||
| CN107241876A | 2017-10-10 | |||
| CN104244616A | 2014-12-24 | |||
| CN104066280A | 2014-09-24 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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