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Patent Searching and Data


Title:
COSMETIC SHEET AND COSMETIC PLATE
Document Type and Number:
WIPO Patent Application WO/2019/065911
Kind Code:
A1
Abstract:
The present invention provides a cosmetic sheet in which flames do not readily spread even when the cosmetic sheet is layered on a substrate having low heat conductivity, and a cosmetic plate in which the cosmetic sheet is layered on a substrate. The present invention provides a cosmetic sheet for layering on a substrate that has a heat conductivity of less than 0.1 W/(m·K) on the side on which the cosmetic sheet is adhered, wherein: (1) the cosmetic sheet comprises a plurality of layers that contain a non-halogen-based thermoplastic resin; (2) at least one layer from among the plurality of layers that contain the resin contains a non-halogen-based flame retardant; (3) formula (I), i.e., y ≥ 0.00008x2 + 0.016x - 2.51, is satisfied, where x is the total thickness (μm) of the plurality of layers that contain the resin, and y is the proportion (in percent by mass) of the total mass of the non-halogen-based flame retardant in the plurality of layers that contain the resin relative to 100% by mass of the total mass of the plurality of layers that contain the resin; and (4) the non-halogen-based flame retardant content in each of the plurality of layers that contain the non-halogen-based flame retardant is at least 8% by mass.

Inventors:
HORIO, Yoshiaki (1-1, Ichigaya Kagacho 1-Chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
OGASAWARA, Takeru (1-1, Ichigaya Kagacho 1-Chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
FURUTA, Satoshi (1-1, Ichigaya Kagacho 1-Chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
HAMAGUCHI, Tomoyuki (1-1, Ichigaya Kagacho 1-Chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
Application Number:
JP2018/036121
Publication Date:
April 04, 2019
Filing Date:
September 27, 2018
Export Citation:
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Assignee:
DAI NIPPON PRINTING CO., LTD. (1-1 Ichigaya Kagacho 1-Chome, Shinjuku-ku Tokyo, 01, 〒1628001, JP)
International Classes:
B32B27/18; B32B21/08; B32B27/00; E04B1/94
Domestic Patent References:
WO2016076360A12016-05-19
Foreign References:
JP2015182379A2015-10-22
JP2017019274A2017-01-26
JP2007100045A2007-04-19
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (Kitahama TNK Building, 1-7-1 Doshomachi, Chuo-ku, Osaka-sh, Osaka 45, 〒5410045, JP)
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