Title:
COUPLER, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/129251
Kind Code:
A1
Abstract:
The present invention reduces differences in attenuation according to frequency while suppressing the contact resistance of a conductor film and a resistive film. A coupler (1A) is provided with: an input terminal and an output terminal each provided on a substrate (substrate (K1), planarizing film (H0), and insulation film (H01)); a main line provided on the substrate, one end of the main line being connected to the input terminal and the other end being connected to the output terminal; and a secondary line including a conductor film (M1) and a resistive film (R1) each provided on the substrate, the secondary line being electromagnetically coupled to the main line in a portion of the conductor film (M1); the conductor film (M1) having wiring patterns (L23, L25); the resistive film (R1) having a resistive film pattern (R13) including an end part (R13a) disposed so as to fit in between the wiring pattern (L23) and the substrate, and an end part (R13b) disposed so as to fit in between the wiring pattern (L25) and the substrate; and at least the top surface and end surface of each of the end parts (R13a, R13b) touching the conductor film (M1).
Inventors:
SUGA TAKESHI (JP)
FUJIWARA TOSHIYASU (JP)
FUJIWARA TOSHIYASU (JP)
Application Number:
PCT/JP2013/054513
Publication Date:
September 06, 2013
Filing Date:
February 22, 2013
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01P1/26; H01P5/18
Foreign References:
| JP2009044303A | 2009-02-26 | |||
| JPH01179353A | 1989-07-17 | |||
| JPH01158763A | 1989-06-21 | |||
| JP2004014834A | 2004-01-15 | |||
| JP2012023661A | 2012-02-02 | |||
| JP2010003934A | 2010-01-07 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
Mitsuhiro Washizu (JP)
Mitsuhiro Washizu (JP)
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Claims: