Title:
COVER MATERIAL FOR AIRTIGHT SEALING, PACKAGE FOR HOUSING ELECTRONIC COMPONENTS, AND METHOD FOR MANUFACTURING COVER MATERIAL FOR AIRTIGHT SEALING
Document Type and Number:
WIPO Patent Application WO/2012/108083
Kind Code:
A1
Abstract:
Provided is a cover material for airtight sealing that uses a glass material that does not contain Pb and that can sufficiently assure airtightness of a package for housing electronic components. This cover material for airtight sealing (1, 201) is formed from a metal base material (12, 212) containing a metal material that contains at least Cr, a coating layer(s) (13, 213a, 213b) that is formed from a Cr oxide film and formed on the surface of the metal base material, and a joining layer (11) for joining the metal base material on which the coating layer is formed with an electronic component housing material (30), said joining layer (11) formed on the surface of the coating layer and formed from a glass material that does not contain Pb.
Inventors:
YAMAMOTO MASAHARU (JP)
Application Number:
PCT/JP2011/075281
Publication Date:
August 16, 2012
Filing Date:
November 02, 2011
Export Citation:
Assignee:
NEOMAX MATERIALS CO LTD (JP)
YAMAMOTO MASAHARU (JP)
YAMAMOTO MASAHARU (JP)
International Classes:
H01L23/02; H01L23/10; H03H9/02
Foreign References:
| JP2008271093A | 2008-11-06 | |||
| JPH02303053A | 1990-12-17 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
Hirokazu Miyazono (JP)
Hirokazu Miyazono (JP)
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Claims: