Title:
COVER MATERIAL FOR HERMETIC SEALING AND ELECTRONIC COMPONENT-CONTAINING PACKAGE
Document Type and Number:
WIPO Patent Application WO/2016/121586
Kind Code:
A1
Abstract:
This cover material for hermetic sealing (1) is formed of a cladding material (10) that is provided with: a base layer (11) which is formed of an Fe alloy containing 4% by mass or more of Cr; and a silver brazing material layer (13) which is bonded to the electronic component-containing member-side surface of the base layer, with an intermediate layer (12) being interposed therebetween.
Inventors:
YOKOTA MASAYUKI (JP)
YAMAMOTO MASAHARU (JP)
YAMAMOTO MASAHARU (JP)
Application Number:
PCT/JP2016/051511
Publication Date:
August 04, 2016
Filing Date:
January 20, 2016
Export Citation:
Assignee:
HITACHI METALS NEOMATERIAL LTD (JP)
HITACHI METALS LTD (JP)
HITACHI METALS LTD (JP)
International Classes:
H01L23/02; H01L23/06; H03H9/02
Domestic Patent References:
| WO2013183315A1 | 2013-12-12 |
Foreign References:
| JP5632563B2 | 2014-11-26 | |||
| JP2005151493A | 2005-06-09 | |||
| JPH02303053A | 1990-12-17 | |||
| JP2003209197A | 2003-07-25 |
Other References:
See also references of EP 3252807A4
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
Hirokazu Miyazono (JP)
Hirokazu Miyazono (JP)
Download PDF: