Title:
COVER TAPE AND ELECTRONIC-COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/044921
Kind Code:
A1
Abstract:
A cover tape comprising at least a base layer and a heat seal layer, wherein the heat seal layer comprises copolymers (A) of a styrene-based hydrocarbon and a conjugated-diene-based hydrocarbon, the (A) ingredient comprises a block copolymer (A-1) of 10-50 mass%, excluding 50 mass%, styrene-based hydrocarbon and 50-90 mass%, excluding 50 mass%, conjugated-diene-based hydrocarbon and a block copolymer (A-2) of 50-95 mass% styrene-based hydrocarbon and 5-50 mass% conjugated-diene-based hydrocarbon, the content of the (A-1) ingredient being 35-60 mass% with respect to the whole heat seal layer, and the mass ratio of the (A-2) ingredient to the (A-1) ingredient being 0.30-1.0.
Inventors:
NABA KEISUKE (JP)
NAKAJIMA GOSUKE (JP)
ATSUSAKA TAKANORI (JP)
TOKUNAGA HISATSUGU (JP)
NAKAJIMA GOSUKE (JP)
ATSUSAKA TAKANORI (JP)
TOKUNAGA HISATSUGU (JP)
Application Number:
PCT/JP2021/030215
Publication Date:
March 03, 2022
Filing Date:
August 18, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B65D65/02; B32B27/28; B32B27/30; B32B27/32; B65D75/34; B65D85/86
Domestic Patent References:
| WO2007123241A1 | 2007-11-01 |
Foreign References:
| JP2004244115A | 2004-09-02 | |||
| JP2006347603A | 2006-12-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: FIBER-REINFORCED POLYAMIDE RESIN COMPOSITION MOLDED ARTICLE
Next Patent: COVER TAPE AND ELECTRONIC COMPONENT PACKAGE
Next Patent: COVER TAPE AND ELECTRONIC COMPONENT PACKAGE