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Title:
FIBER-REINFORCED POLYAMIDE RESIN COMPOSITION MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/044920
Kind Code:
A1
Abstract:
A fiber-reinforced polyamide resin composition molded article which is characterized by being composed of from 5 parts by weight to 50 parts by weight of reinforcing fibers (A), from 40 parts by weight to 94.9 parts by weight of a polyamide resin composition (B), and from 0.1 part by weight to 10 parts by weight of an ammonium salt (C) that is composed of ammonia and an aliphatic dicarboxylic acid having from 6 to 12 carbon atoms, and which is also characterized in that: the weight average fiber length (Lwa1) of the reinforcing fibers (A) is from 0.4 mm to 7 mm; the polyamide resin composition (B) is composed of a polyamide resin (B1), a resin (B2) that has a reactive functional group, and a compound (B3) that is produced by a reaction between the resin (B1) and the resin (B2); and the resin (B2) is dispersed in the form of particles that have a number average particle diameter of from 10 nm to 1,000 nm. The present invention enables the achievement of a fiber-reinforced polyamide resin composition molded article which has excellent mechanical characteristics (bending characteristics and impact resistance characteristics), while exhibiting excellent fiber dispersibility, moldability and stiffness upon water absorption.

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Inventors:
HIRATA SHIN (JP)
HAMAGUCHI MITSUSHIGE (JP)
MORIOKA NOBUHIRO (JP)
SUZUKI TAKAFUMI (JP)
Application Number:
PCT/JP2021/030213
Publication Date:
March 03, 2022
Filing Date:
August 18, 2021
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B29B11/16; C08K5/17; C08K7/02; C08K7/06; C08L23/00; C08L77/00; C08L101/02
Domestic Patent References:
WO2014098103A12014-06-26
WO2010107022A12010-09-23
WO2021006257A12021-01-14
WO2014098103A12014-06-26
WO2010107022A12010-09-23
Foreign References:
JP2012162613A2012-08-30
JP2021014499A2021-02-12
JP2013249363A2013-12-12
JPH11140237A1999-05-25
JP2019151712A2019-09-12
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
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