COVER TAPE AND ELECTRONIC COMPONENT PACKAGING BODY INCLUDING SAME

Title:

COVER TAPE AND ELECTRONIC COMPONENT PACKAGING BODY INCLUDING SAME

Document Type and Number:

WIPO Patent Application WO/2023/195284

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a cover tape to which an electronic component is less likely to adhere when the cover tape is released to extract the electronic component.　This cover tape comprises an insulative heat seal layer provided on one surface and a conductive layer directly laminated on the heat seal layer, wherein a heat seal layer side has a surface resistivity of 1 × 1010Ω／□ or less, and the heat seal layer has a thickness of less than 600 nm.　

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Inventors:

NIWA SAORI (JP)
ATSUSAKA TAKANORI (JP)

Application Number:

PCT/JP2023/008305

Publication Date:

October 12, 2023

Filing Date:

March 06, 2023

Export Citation:

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Assignee:

DENKA COMPANY LTD (JP)

International Classes:

B32B7/025; B32B27/18; B65D73/02

Domestic Patent References:

WO2012143994A1

2012-10-26

Foreign References:

JPH07223674A	1995-08-22
JP2014031197A	2014-02-20
JPH11286079A	1999-10-19

Attorney, Agent or Firm:

SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)

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