Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT

Title:

Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT

Document Type and Number:

WIPO Patent Application WO/2021/140915

Kind Code:

A1

Abstract:

Provided is a copper alloy sheet material which exhibits etching properties that are advantageous for achieving high dimensional accuracy even when etching is carried out with an extremely narrow pitch, has a chemical composition that contains, in terms of mass%, 1.00-4.50% of Ni and 0.10-1.40% of Si and, if necessary, an appropriate amount of one or more of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag, and in which in EBSD measurements of a cross section that is perpendicular to a rolling direction, if SS denotes the area of a region that satisfies at least one of the following conditions: the difference in crystal orientation from an S1 orientation (241)<112> is not more than 10° and the difference in crystal orientation from an S2 orientation (231)<124> is not more than 10°, and SB denotes the area of a region in which the difference in crystal orientation from a Brass orientation (011)<211>, the areal ratio SB/SS is 0.40 or more.

Inventors:

JIANG WANQING (JP)
HYODO HIROSHI (JP)
SUDA HISASHI (JP)
SUGAWARA AKIRA (JP)

Application Number:

PCT/JP2020/048167

Publication Date:

July 15, 2021

Filing Date:

December 23, 2020

Export Citation:

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Assignee:

DOWA METALTECH CO LTD (JP)

International Classes:

C22C9/06; C22C9/10; C22F1/08; C22F1/00

Foreign References:

JP2018178243A	2018-11-15
JP2018035437A	2018-03-08
JP2012126930A	2012-07-05
JP2019077889A	2019-05-23

Other References: