Title:
Cu-Ni-Si-Mg-BASED ALLOY HAVING IMPROVED ELECTRICAL CONDUCTIVITY AND BENDABILITY
Document Type and Number:
WIPO Patent Application WO/2010/126046
Kind Code:
A1
Abstract:
Disclosed is a Cu-Ni-Si-Mg-based alloy comprising 1.0 to 4.5% by mass of Ni, 0.16 to 1.13% by mass of Si, and 0.05 to 0.30% by mass of Mg, with the remainder being Cu and unavoidable impurities. The Cu-Ni-Si-Mg-based alloy contains Ni-Si-Mg precipitates (X) and Ni-Si precipitates (Y), wherein the average particle diameter of the precipitates (X) is 0.05 to 3.0 μm, there is contained no precipitate (X) having a particle diameter of larger than 10 μm, and the average particle diameter of the precipitates (Y) is 0.01 to 0.10 μm. The copper alloy may contain Cr, P, Mn, Ag, Co, Mo, As, Sb, Al, Hf, Zr, Ti, C, Fe, In, Ta, Sn or Zn in the total amount of 0.01 to 2.0% by mass. Preferably, the precipitates (X) are contained at a density of 103 to 105 particles/mm2 and the precipitates (Y) are contained at a density of 1.0 × 108 to 1.0 × 1011 particles/mm2. The Cu-Ni-Si-Mg-based alloy has high strength, high electrical conductivity, and good bending workability, and also has excellent stress relaxation resistance under high temperatures.
Inventors:
KATO HIRONORI (JP)
Application Number:
PCT/JP2010/057468
Publication Date:
November 04, 2010
Filing Date:
April 27, 2010
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
KATO HIRONORI (JP)
KATO HIRONORI (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; C22F1/00
Foreign References:
| JP2006233314A | 2006-09-07 | |||
| JP2008127668A | 2008-06-05 |
Other References:
MASATAKA MIZUNO ET AL.: "Cu-Ni-Si-Kei Gokin no Mg Tenka ni Tomonau Soshiki to Tokusei no Henka", JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 38, 7 September 1999 (1999-09-07), pages 291 - 297
SEISHO MIURA ET AL.: "Relationship between the heat resistance and precipitates control in a Cu-Ni-Si alloy", COPPER AND COPPER ALLOY, vol. 47, no. 1, 2008, pages 61 - 65
SEISHO MIURA ET AL.: "Relationship between the heat resistance and precipitates control in a Cu-Ni-Si alloy", COPPER AND COPPER ALLOY, vol. 47, no. 1, 2008, pages 61 - 65
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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