Title:
CURABLE COMPOSITION, CURED PRODUCT AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2022/102332
Kind Code:
A1
Abstract:
The present invention provides: a curable composition which contains (A) a blocked isocyanate prepolymer that uses (a1) a polyol compound, (a2) a polyisocyanate compound and (a3) a blocking agent as essential starting materials, (B) an epoxy resin and (C) a curing agent, and which is characterized in that the blocking agent (a3) contains a phenolic compound that comprises a hydrocarbon group having 12 or more carbon atoms; a cured product of this curable composition; and an adhesive. This curable composition has excellent adhesiveness and excellent wet heat resistance, and is suitable for use in an adhesive and the like.
Inventors:
OZAWA RYOSUKE (JP)
SUGANUMA HAJIME (JP)
YAMAZAKI TAKESHI (JP)
SUGANUMA HAJIME (JP)
YAMAZAKI TAKESHI (JP)
Application Number:
PCT/JP2021/037984
Publication Date:
May 19, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/46; C08G18/10; C08G18/58; C08G18/80; C09J11/06; C09J163/00; C09J175/04; C09J175/08
Foreign References:
| JPH08302280A | 1996-11-19 | |||
| JPH0953043A | 1997-02-25 | |||
| JPH0841163A | 1996-02-13 | |||
| JPH07207229A | 1995-08-08 | |||
| JP2004225095A | 2004-08-12 | |||
| JPH0770501A | 1995-03-14 | |||
| JP2010185034A | 2010-08-26 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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