CURABLE COMPOSITION AND CURED PRODUCT

Title:

CURABLE COMPOSITION AND CURED PRODUCT

Document Type and Number:

WIPO Patent Application WO/2018/051940

Kind Code:

A1

Abstract:

A curable composition containing: an epoxy compound (A) having a melting point of at least 50°C; a polymerizable compound (B); a polymerization initiator (C); and a colorant (D). The polymerizable compound (B) is preferably: an unsaturated compound having a structure obtained by esterification of an epoxy compound represented by general formula (I) and an unsaturated monobasic acid; or an unsaturated compound having a structure obtained by further esterification of a polybasic acid anhydride and the unsaturated compound having a structure obtained by esterification of an epoxy compound represented by general formula (I) and an unsaturated monobasic acid.

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Inventors:

SHINOZUKA TOYOFUMI (JP)
SHINAGAWA MASUMI (JP)
NAKATA YUUYA (JP)

Application Number:

PCT/JP2017/032649

Publication Date:

March 22, 2018

Filing Date:

September 11, 2017

Export Citation:

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Assignee:

ADEKA CORP (JP)

International Classes:

C08L63/10; C08F2/44; C08F290/06; C08G59/17; C08G59/20; G02B5/20; G03F7/004; G03F7/027; G03F7/031

Foreign References:

JP2016061939A	2016-04-25
JP5244991B1	2013-07-24
JP2014115522A	2014-06-26

Attorney, Agent or Firm:

SHOWA INTERNATIONAL PATENT FIRM (JP)

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