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Title:
CURABLE COMPOSITION, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/209230
Kind Code:
A1
Abstract:
Provided are: a curable composition containing a heat-conductive filler (A), including at least one selected from the group consisting of heat-conductive fillers A having a volume average particle size of 0.3 μm to less than 1 μm and heat-conductive fillers B having a volume average particle size of 1 μm to less than 10 μm, and a heat-conductive filler C having a volume average particle size of 10-15 μm (inclusive), a monomer (B) having a (meth)acryloyl group, a polymerization initiator (C), and a dispersant (D), based on the total mass of the heat-conductive filler (A), the content X of the heat-conductive filler A being 0-40 mass%, the content Y of the heat-conductive filler B being 0-40 mass%, and the content Z of the heat-conductive filler C being 20-60 mass% (where, content X and content Y are not both 0 mass%); and a cured product thereof.

Inventors:
ITO GENKI (JP)
TERAUCHI RYUJI (JP)
WATANABE SATOSHI (JP)
Application Number:
PCT/JP2022/002950
Publication Date:
October 06, 2022
Filing Date:
January 26, 2022
Export Citation:
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Assignee:
COSMO OIL LUBRICANTS CO LTD (JP)
International Classes:
C08F20/10; C08F2/44
Domestic Patent References:
WO2020149193A12020-07-23
WO2020149193A12020-07-23
Foreign References:
JP2016188297A2016-11-04
JP2021038318A2021-03-11
JP2021061631A2021-04-15
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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