Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/094274
Kind Code:
A1
Abstract:
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties, while securing practical surface curability and deep-section curability. Specifically disclosed is a curable composition characterized by containing (A) 1-80 parts by weight of an organic polymer having a reactive silicon group such as an alkyldialkoxysilyl group in a molecule, (B) 99-20 parts by weight of an organic polymer having a reactive silicon group such as a trialkoxysilyl group in a molecule, wherein the main chain backbone contains a repeating unit common with that of the component (A), and (C) 0.1-30 parts by weight of an amidine compound per 100 parts by weight of the total of the components (A) and (B).
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Inventors:
YANO AYAKO (JP)
MATSUSHITA NORIKO (JP)
OKAMOTO TOSHIHIKO (JP)
MATSUSHITA NORIKO (JP)
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2007/052420
Publication Date:
August 23, 2007
Filing Date:
February 09, 2007
Export Citation:
Assignee:
KANEKA CORP (JP)
YANO AYAKO (JP)
MATSUSHITA NORIKO (JP)
OKAMOTO TOSHIHIKO (JP)
YANO AYAKO (JP)
MATSUSHITA NORIKO (JP)
OKAMOTO TOSHIHIKO (JP)
International Classes:
C08L101/10; C08K5/00; C08K5/31; C08L23/26; C08L33/14; C08L71/02; C09J123/26; C09J133/04; C09J143/04; C09J171/02; C09J201/10; C09K3/10
Domestic Patent References:
| WO1998047939A1 | 1998-10-29 |
Foreign References:
| JP2005213446A | 2005-08-11 | |||
| JP2005248175A | 2005-09-15 | |||
| JP2001220568A | 2001-08-14 | |||
| JP2001072855A | 2001-03-21 |
Other References:
See also references of EP 1990370A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi, Osaka 88, JP)
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