CURABLE COMPOSITION - MOMENTIVE PERFORMANCE MAT JP

Title:

CURABLE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2021/125059

Kind Code:

A1

Abstract:

Provided is a curable composition that can provide a cured product excellent in adhesiveness to various substrates.　A curable composition comprising: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxy group and hydrolyzable groups; (B) a compound having at least two OR2 groups (in the formula, R2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being -O- group, and a group other than groups having siloxane bonds.

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Inventors:

IIDA ISAO (JP)
ONO KAZUHISA (JP)
FUJIMOTO TETSUO (JP)
MARUHASHI KAZUKI (JP)
MITSUHASHI HISASHI (JP)

Application Number:

PCT/JP2020/046153

Publication Date:

June 24, 2021

Filing Date:

December 10, 2020

Export Citation:

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Assignee:

MOMENTIVE PERFORMANCE MAT JP (JP)
DAIKIN IND LTD (JP)

International Classes:

C08K5/54; C08L71/02

Domestic Patent References:

WO2019088129A1	2019-05-09
WO2014069592A1	2014-05-08

Foreign References:

JP2014501804A	2014-01-23
US20100129672A1	2010-05-27
US20180282578A1	2018-10-04
CN109988504A	2019-07-09
US20140302267A1	2014-10-09
JPH09263640A	1997-10-07
JP2013117012A	2013-06-13
JP2013067604A	2013-04-18
JP3831481B2	2006-10-11