Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/058649
Kind Code:
A1
Abstract:
The present application provides a curable composition, a thermal interface material (TIM), and uses thereof. In the present application, the curable composition or thermal interface material can exhibit high thermal conductivity while exhibiting low adhesion to a predetermined adherend. In addition, in the present invention, the low adhesiveness may be achieved without the use of an adhesion-adjusting component such as a plasticizer or with a minimized use ratio thereof. In the present application, the curable composition can also exhibit a precisely controlled cure rate while simultaneously having excellent curing properties. The present application can also provide a product containing the curable composition, a cured body thereof, or the thermal interface material.
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Inventors:
LEE JEONG HYUN (KR)
SON HO YEON (KR)
JUN SHIN HEE (KR)
SON HO YEON (KR)
JUN SHIN HEE (KR)
Application Number:
PCT/KR2023/095057
Publication Date:
March 21, 2024
Filing Date:
September 15, 2023
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G18/38; C08G18/10; C08G18/24; C08G18/34; C08G18/42
Foreign References:
KR20210030235A | 2021-03-17 | |||
KR20220043762A | 2022-04-05 | |||
JP2011178899A | 2011-09-15 | |||
KR20210121150A | 2021-10-07 | |||
KR20190122451A | 2019-10-30 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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