Title:
CURABLE COMPOUND PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/075325
Kind Code:
A1
Abstract:
Provided is a curable compound product which has excellent storage stability and which, upon heating, rapidly cures to form a cured object having extremely high heat resistance. This curable compound product has the following properties (a) to (e). (a) To have a number-average molecular weight (in terms of standard polystyrene) of 1,000-15,000 (b) To have a proportion of aromatic-ring-derived structures in the whole curable compound product of 50 wt% or higher (c) To have a solubility in a solvent at 23°C of 1 g/100 g or greater (d) To have a glass transition temperature of 80-230°C (e) A 20 wt% NMP solution obtained by vacuum-drying the curable compound product and then dissolving the dried product in NMP has a viscosity (ƞ0) and the solution, after having been placed still for 10 days inside a desiccator held at 23°C, has a viscosity (ƞ10), the viscosities satisfying the following relationship (E). Relationship (E): ƞ10/ƞ0<2
Inventors:
OKANO YOSHIMICHI (JP)
ASADA TAKESHI (JP)
ASADA TAKESHI (JP)
Application Number:
PCT/JP2021/036834
Publication Date:
April 14, 2022
Filing Date:
October 05, 2021
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C07D207/452; B32B7/027; C08F38/00; C08G65/333; C08G65/48; C09D201/00; C09J201/00
Domestic Patent References:
| WO2019244694A1 | 2019-12-26 | |||
| WO2019244693A1 | 2019-12-26 | |||
| WO2019244694A1 | 2019-12-26 |
Foreign References:
| JP2019217048A | 2019-12-26 | |||
| JP2019218659A | 2019-12-26 | |||
| JP2020502310A | 2020-01-23 | |||
| JPS60204758A | 1985-10-16 | |||
| JP2020170857A | 2020-10-15 | |||
| JP2000219741A | 2000-08-08 | |||
| JPS6032642B2 | 1985-07-29 | |||
| JPS4836163A | 1973-05-28 |
Other References:
POLYMER, vol. 30, 1989, pages 978 - 985
Attorney, Agent or Firm:
GOTO & CO. (JP)
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