CURABLE COMPOUND PRODUCT

WIPO Patent Application WO/2022/075324

A1

The present invention provides a curable compound product which has excellent storage stability and excellent formability, and which forms a cured product that has super heat resistance.　A curable compound product according to the present disclosure is provided with the characteristics (a) to (g) described below. (a) The number average molecular weight (in terms of standard polystyrene) is from 1,000 to 15,000. (b) The proportion of structures derived from an aromatic ring in the total amount of the curable compound product is 50% by weight of more. (c) The solvent solubility at 23°C is 1 g/100 g or more. (d) The glass transition temperature is from 80°C to 230°C. (e) The viscosity (η0) of a 20% by weight NMP solution, which is obtained by subjecting the curable compound product to drying under reduced pressure and subsequently dissolving the curable compound product in NMP, and the viscosity (η10) of the solution after being left at rest for 10 days in a desiccator that is held at 23°C satisfy formula (E) η10/η0 < 2. (f) The molecular skeleton has a sulfonyl group. (g) The exothermic onset temperature is 220°C or higher.

WO/2011/070136	IODINE RADIOLABELLING METHOD
JP7361029	curable compound
JPWO2017199778	Polymerizable compounds and compositions, liquid crystal composites, optically anisotropic substances, liquid crystal display devices and their use

OKANO YOSHIMICHI (JP)
NAKATANI KOUJI (JP)

PCT/JP2021/036833

April 14, 2022

October 05, 2021

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DAICEL CORP (JP)

C07D207/452; B32B7/027; C08F38/00; C08G65/333; C08G65/48; C09D201/00; C09J201/00

WO2019244694A1

2019-12-26

JP2020502310A	2020-01-23
JPS60204758A	1985-10-16
JP2020170858A	2020-10-15
JP2000219741A	2000-08-08
JPS4836163A	1973-05-28
JPS62151414A	1987-07-06

GOTO & CO. (JP)

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