Title:
CURABLE EPOXY COMPOSITIONS FOR LOW TEMPERATURE CURING AND STRUCTURAL ADHESIVE THEREFROM, AND METHODS OF USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/202111
Kind Code:
A1
Abstract:
A curable epoxy composition comprising an epoxy resin, a core-shell rubber, a capped polyurethane prepolymer, a hardener, an accelerator, a multifunctional epoxy-terminated prepolymer, along with related methods of making and using the same. The curable epoxy composition could be used as structural adhesives after curing, for example, in automotive industrial bonding applications, which provides very good impact peel strength within wide temperature range, good storage ability and the curable epoxy composition could be cured at low temperature.
Inventors:
ZHAO YUAN (CN)
ZHONG JINFENG (CN)
CHEN QI (CN)
ZHU CHONGYU (CN)
ZHONG JINFENG (CN)
CHEN QI (CN)
ZHU CHONGYU (CN)
Application Number:
PCT/CN2022/139616
Publication Date:
October 26, 2023
Filing Date:
December 16, 2022
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA CO LTD (CN)
HENKEL CHINA CO LTD (CN)
International Classes:
C08L63/00; C08G59/00; C09J163/00
Foreign References:
| CN109593323A | 2019-04-09 | |||
| CN105121498A | 2015-12-02 | |||
| CN107109176A | 2017-08-29 | |||
| US20030187154A1 | 2003-10-02 | |||
| US20150045510A1 | 2015-02-12 |
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LTD. (CN)
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