Title:
CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/183512
Kind Code:
A1
Abstract:
Provided is a curable epoxy resin composition by which can be formed a cured product that has high heat resistance, light resistance, and thermal shock resistance, and in particular has, in the high temperatures of an optical semiconductor device, improved electroconductivity properties and reflow resistance after moisture absorption. This curable epoxy resin composition is characterized by comprising an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by formula (1), and a hydrogenated trimellitic anhydride (C) represented by formula (2). (In formula (1), R1 and R2 each represent a hydrogen atom or C1-8 alkyl group.) (In formula (2), R11 to R13 each represent a hydrogen atom or alkyl group. R14 represents a hydrogen atom or a counterion.)
Inventors:
SUZUKI HIROSE (JP)
Application Number:
PCT/JP2013/064868
Publication Date:
December 12, 2013
Filing Date:
May 29, 2013
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08G59/26; C08G59/42; H01L23/29; H01L23/31; H01L33/56
Foreign References:
| JP2011157462A | 2011-08-18 | |||
| JP2008081596A | 2008-04-10 | |||
| JP2004289102A | 2004-10-14 | |||
| JP2004131553A | 2004-04-30 | |||
| JP2010090371A | 2010-04-22 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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