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Patent Searching and Data


Title:
PACKAGING MATERIAL FOR CELL
Document Type and Number:
WIPO Patent Application WO/2013/183511
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a technique for imparting exceptional moldability and reducing the incidence of cracking and pinholing during molding in a packaging material for a cell comprising a layered film in which at least a base-material layer, an adhesive layer, a metallic layer, and a sealant layer are layered in the stated order. The packaging material for a cell comprising a layered body in which at least a base-material layer, an adhesive layer, a metallic layer, and a sealant layer are layered in the stated order, wherein the packaging material for a cell can be imparted with highly exceptional moldability, and dramatically less prone to pinholing and cracking during molding by using, as the metallic layer, an aluminum foil having 0.2% proof strength of 58-121 N/mm2 when a tensile test is performed in the direction parallel to the rolling direction.

Inventors:
TAKAHAGI ATSUKO (JP)
AKITA HIROHISA (JP)
NISHIDA SUMITO (JP)
Application Number:
PCT/JP2013/064859
Publication Date:
December 12, 2013
Filing Date:
May 29, 2013
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B15/08; H01M50/119; H01M50/121; H01M50/129; H01M50/133; H01M50/186; H01M50/193
Foreign References:
JP2008127656A2008-06-05
JPH11214856A1999-08-06
JP2005163077A2005-06-23
JP2001176459A2001-06-29
JP2006236938A2006-09-07
JP2002187233A2002-07-02
JP2000123800A2000-04-28
JP2008287971A2008-11-27
Other References:
AKIRA OTA: "Press Processing Engineering Manual", 30 July 1981, NIKKAN KOGYO SHIMBUN, LTD., pages: 1 - 3
See also references of EP 2858138A4
Attorney, Agent or Firm:
Yamada, Iichiro et al. (JP)
Yamada 威 1 郎 (JP)
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