Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION, ORGANOPOLYSILOXANE ADHESIVE LAYER OBTAINED BY CURING SAME, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/042744
Kind Code:
A1
Abstract:
[Problem] To provide a curable reactive organopolysiloxane composition that can be made heat curable/light curable, enables design of a composition coatable even at a low solvent content and has sufficient adhesive strength, a cured product thereof and use of the composition. [Solution] A curable organopolysiloxane composition comprising (A) a chain-form organopolysiloxane having an alkenyl group, (B) a specific MQ-type organopolysiloxane resin and (C) a radical polymerization initiator, optionally together with (D) one or more radical reactive components selected from (D1) a vinyl monomer and (D2) a (meth)acryl group-containing organopolysiloxane compound, wherein the sum of the contents of component (A), component (B) and component (D2) is 50 mass% or more relative to the total mass of the solid content of the composition, and use of the composition.
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Inventors:
YOKOUCHI YUKI (JP)
IIMURA TOMOHIRO (JP)
SUTO MICHITAKA (JP)
IIMURA TOMOHIRO (JP)
SUTO MICHITAKA (JP)
Application Number:
PCT/JP2022/033708
Publication Date:
March 23, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08F290/14; B32B27/00; C08F2/38; C08F2/44; C08F283/12; C08L83/07; C09J4/02; C09J7/38; C09J183/06; C09J183/07
Domestic Patent References:
WO2021124724A1 | 2021-06-24 |
Foreign References:
JP2021045953A | 2021-03-25 | |||
JP2021108319A | 2021-07-29 | |||
JP2005053966A | 2005-03-03 | |||
JPH0286678A | 1990-03-27 | |||
JP2020523422A | 2020-08-06 | |||
JP2016124967A | 2016-07-11 |
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