Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION, THERMALLY CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/038888
Kind Code:
A1
Abstract:
[Problem] To provide: a curable organopolysiloxane composition which can be cured at a low temperature while having high thermal conductivity and from which an organopolysiloxane cured product is obtained which can achieve high initial adhesion and adhesive strength with respect to various substrates in contact with the composition during curing; a thermally conductive member formed thereof; and a heat dissipation structure using the same. [Solution] Provided are a curable organopolysiloxane composition and a used thereof, the curable organopolysiloxane composition containing: (A) an alkenyl group-containing organopolysiloxane having a specific viscosity; (B) an organohydrogenpolysiloxane; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) a siloxane-based compound having, at a specific molecular chain end, an alkenyl group and a hydrolyzable silyl group; (F) an alkoxysilane having an alkyl group having at least six carbon atoms or a hydrolyzed condensate thereof; and (G) an adhesion promoter.
Inventors:
OTA KENJI (JP)
Application Number:
PCT/JP2021/023451
Publication Date:
February 24, 2022
Filing Date:
June 21, 2021
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
H01L23/36; C08K3/22; C08K5/5419; C08L83/05; C08L83/07; H01L23/373
Domestic Patent References:
| WO2016038836A1 | 2016-03-17 | |||
| WO2019061290A1 | 2019-04-04 | |||
| WO2020093258A1 | 2020-05-14 |
Foreign References:
| JP2006274155A | 2006-10-12 | |||
| JP2008239719A | 2008-10-09 | |||
| JP2008239719A | 2008-10-09 | |||
| JP2006274155A | 2006-10-12 | |||
| JP2007177001A | 2007-07-12 | |||
| JPS528854B2 | 1977-03-11 | |||
| JPH10195085A | 1998-07-28 | |||
| JP2014503680W |
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