CURABLE RESIN COMPOSITION, ADHESIVE FOR OPTICAL LIGHT-RECEIVING AND EMITTING MODULE, SEALING AGENT FOR OPTICAL LIGHT-RECEIVING AND EMITTING MODULE, AND MEMBER FOR OPTICAL LIGHT-RECEIVING AND EMITTING MODULE

Title:

Document Type and Number:

WIPO Patent Application WO/2022/215644

Kind Code:

A1

Abstract:

Provided is a curable resin composition which has excellent coating workability and from which a member having excellent light shielding properties in the visible light region to the near-infrared region.　The curable resin composition, which has a light-shielding property, comprises: an epoxy resin; and a composite including a carbon material having a graphene laminated structure and a resin, wherein the content of the composite is 0.1 wt% to 30 wt% with respect to the total curable resin composition.

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Inventors:

SUEMATSU MIKITOSHI (JP)
URAYAMA TAKAHIRO (JP)
ENAMI TOSHIO (JP)
SATO KENICHIRO (JP)

Application Number:

PCT/JP2022/016480

Publication Date:

October 13, 2022

Filing Date:

March 31, 2022

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

C08L63/00; C08K3/04

Domestic Patent References:

WO2018159566A1	2018-09-07
WO2020027023A1	2020-02-06
WO2015016316A1	2015-02-05

Foreign References:

JP2018159059A	2018-10-11
CN101942179A	2011-01-12
CN107556492A	2018-01-09

Attorney, Agent or Firm:

OSAKA FRONT (JP)

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