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Title:
CURABLE RESIN COMPOSITION, COATING LAYER, AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/054559
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a curable resin composition giving cured objects excellent in terms of hardness and transparency. Another is to provide a coating layer and a film which are formed using the curable resin composition. This curable resin composition comprises a curable resin, a photopolymerization initiator, and a metal alkoxide, wherein the curable resin comprises an organic silane compound having a cationically polymerizable group and a cationically polymerizable compound which is not the organic silane compound having a cationically polymerizable group.

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Inventors:
UCHINO SHINYA (JP)
Application Number:
PCT/JP2022/036372
Publication Date:
April 06, 2023
Filing Date:
September 29, 2022
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K5/057
Domestic Patent References:
WO2020067046A12020-04-02
Foreign References:
CN110437739A2019-11-12
JPH11260148A1999-09-24
KR101965682B12019-04-03
JP2001232730A2001-08-28
JP2017134902A2017-08-03
JP2016060761A2016-04-25
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF:
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