Title:
CURABLE RESIN COMPOSITION, COATING LAYER, AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/054560
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a curable resin composition excellent in terms of coloration, cured-object hardness, and inner-portion curability. Another is to provide a coating layer and a film which are formed using the curable resin composition. This curable resin composition comprises a curable resin, a photopolymerization initiator, and a dye, wherein the curable resin comprises an organic silane compound having a cationically polymerizable group and a cationically polymerizable compound which is not the organic silane compound having a cationically polymerizable group and wherein the absorbance ratio between the photopolymerization initiator and the dye at an absorption-peak wavelength for the photopolymerization initiator, (absorbance of the photopolymerization initiator)/(absorbance of the dye), of 0.8 or greater.
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Inventors:
UCHINO SHINYA (JP)
Application Number:
PCT/JP2022/036374
Publication Date:
April 06, 2023
Filing Date:
September 29, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K5/00
Domestic Patent References:
| WO2021098990A1 | 2021-05-27 |
Foreign References:
| JP2021009205A | 2021-01-28 | |||
| JPH06506435A | 1994-07-21 | |||
| US20070240365A1 | 2007-10-18 | |||
| JPH11161138A | 1999-06-18 | |||
| JP2012054060A | 2012-03-15 | |||
| JP2008280453A | 2008-11-20 | |||
| KR20180072268A | 2018-06-29 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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