Title:
CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2014/181754
Kind Code:
A1
Abstract:
The present invention relates to a curable resin composition comprising (A) an epoxy compound having at least three epoxy groups per molecule and (B) an active hydrogen compound.
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Inventors:
KAJI SATORU (JP)
WATANABE RYOKO (JP)
KODAMA TAMOTSU (JP)
WATANABE RYOKO (JP)
KODAMA TAMOTSU (JP)
Application Number:
PCT/JP2014/062092
Publication Date:
November 13, 2014
Filing Date:
May 01, 2014
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP (JP)
International Classes:
C08G59/32; C08L63/00; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2008133108A1 | 2008-11-06 | |||
| WO2007046399A1 | 2007-04-26 |
Foreign References:
| JP2012236894A | 2012-12-06 | |||
| JP2012236893A | 2012-12-06 | |||
| JP2007246602A | 2007-09-27 | |||
| JP2007302825A | 2007-11-22 | |||
| JP2012041381A | 2012-03-01 | |||
| JP2009270027A | 2009-11-19 | |||
| JP2011074355A | 2011-04-14 | |||
| JP2010083955A | 2010-04-15 | |||
| JP2010053203A | 2010-03-11 | |||
| JP3523098B2 | 2004-04-26 | |||
| US3775452A | 1973-11-27 | |||
| US3159601A | 1964-12-01 | |||
| US3220972A | 1965-11-30 |
Other References:
SPEIER, J.L.; WEBSTER J.A; BAMES G.H., LAM. CHEM. SOC., vol. 79, 1957, pages 974
See also references of EP 2995634A4
See also references of EP 2995634A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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