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Title:
CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/107200
Kind Code:
A1
Abstract:
This curable resin composition includes a (meth)acrylic polyol, a hydrogenated polyolefin polyol, and a polyisocyanate. The (meth)acrylic polyol is configured from a polymer, which has a hydroxyl value of 5 to 150 mgKOH/g, a glass transition temperature of -70 to -40°C, a number average molecular weight of 500 to 20000, and which is in a liquid state at 25°C. The hydrogenated polyolefin polyol has an iodine value of 15 or less. The electrical component (1) has a sealing material (2) configured from a cured product of the curable resin composition.

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Inventors:
TAKAKURA AKIRA (JP)
OKUHIRA HIROYUKI (JP)
KANIE KATSUHIRO (JP)
Application Number:
PCT/JP2018/042662
Publication Date:
June 06, 2019
Filing Date:
November 19, 2018
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
C08G18/40; C08G18/62; C08G18/73; C08G18/76; C08G18/78; C09J109/00; C09J123/00; C09J133/14; C09J175/04; C09K3/10
Domestic Patent References:
WO2016124499A12016-08-11
WO2015019598A12015-02-12
Foreign References:
JP2017171752A2017-09-28
JP2011153204A2011-08-11
JP2012212805A2012-11-01
JP2012214703A2012-11-08
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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