Title:
CURABLE RESIN COMPOSITION AND HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/157978
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition which has satisfactory handleability and high flexibility and which, after having undergone a curing reaction, is excellent in terms of adhesion strength at room temperature and high temperatures and high-temperature creep resistance. The curable resin composition comprises a modified polyolefin A and an organic polymer C, and is characterized in that the modified polyolefin A is a polymer obtained by graft-polymerizing a compound having a moisture-curable functional group with a polyolefin a and the organic polymer C has a glass transition point of -40°C or lower and is incompatible with the modified polyolefin A.
Inventors:
YOSHINO KENTO (JP)
SASAI TAMAYO (JP)
SASAI TAMAYO (JP)
Application Number:
PCT/JP2023/006207
Publication Date:
August 24, 2023
Filing Date:
February 21, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L23/26; C09J123/26
Domestic Patent References:
| WO2021157467A1 | 2021-08-12 |
Foreign References:
| US20040180154A1 | 2004-09-16 | |||
| JPH1088096A | 1998-04-07 |
Download PDF:
Previous Patent: VIRAL VECTOR PRODUCTIVITY ENHANCER AND PRODUCTION METHOD OF VIRAL VECTOR
Next Patent: CURABLE RESIN COMPOSITION AND HOT MELT ADHESIVE
Next Patent: CURABLE RESIN COMPOSITION AND HOT MELT ADHESIVE