Title:
CURABLE RESIN COMPOSITION AND HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/157979
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition that has good handling properties in a low-temperature molten state and high flexibility and, after curing reaction, shows excellent adhesive strength and thermal creep resistance at room and high temperatures. This curable resin composition, which contains a modified polyolefin A, a polyolefin B and an organic polymer C, is characterized in that; the modified polyolefin A is a polymer obtained by graft polymerization of a polyolefin polymer a with a compound having a moisture-curing functional group; the softening point of the polyolefin polymer a is 80°C or higher and lower than 120°C; the softening point of the polyolefin B is 120-170°C inclusive; the glass transition temperature of the organic polymer C is -35°C or lower; and the organic polymer C is incompatible with the modified polyolefin A and the polyolefin B.
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Inventors:
YOSHINO KENTO (JP)
SASAI TAMAYO (JP)
SASAI TAMAYO (JP)
Application Number:
PCT/JP2023/006208
Publication Date:
August 24, 2023
Filing Date:
February 21, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L23/26; C09J123/26
Domestic Patent References:
| WO2019048593A1 | 2019-03-14 | |||
| WO2017047805A1 | 2017-03-23 | |||
| WO2019142716A1 | 2019-07-25 | |||
| WO2021132523A1 | 2021-07-01 |
Foreign References:
| JP2010229199A | 2010-10-14 | |||
| JP2004176028A | 2004-06-24 |
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