Title:
CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING BONDED PART OBTAINED WITH THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/115231
Kind Code:
A1
Abstract:
A one-pack type curable composition which mitigates problems of cationic polymerization, anionic polymerization, or amine polyaddition polymerization type one-pack compositions of compounds having an epoxy or/and episulfide group which are represented by epoxy resins. It combines photocurability with heat-curability, is easy to handle, and is easily regulated with respect to properties of a cured object thereof, such as adhesive properties. The composition comprises, as major components, (A) a compound having at least one epoxy group or/and episulfide group per molecule, (B) a cationic photopolymerization initiator, and (C) a heat-curable catalyst and/or hardener whose surface has been chemically or physically masked. The curable composition has photo- and/or heat-polymerizability.
Inventors:
TANAKA SHIGEO (JP)
KOJIMA KAZUHIRO (JP)
UCHIDA MITSUHIKO (JP)
KOJIMA KAZUHIRO (JP)
UCHIDA MITSUHIKO (JP)
Application Number:
PCT/JP2006/308477
Publication Date:
November 02, 2006
Filing Date:
April 17, 2006
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
TANAKA SHIGEO (JP)
KOJIMA KAZUHIRO (JP)
UCHIDA MITSUHIKO (JP)
TANAKA SHIGEO (JP)
KOJIMA KAZUHIRO (JP)
UCHIDA MITSUHIKO (JP)
International Classes:
C08G59/40; C09J5/00; C09J11/00; C09J163/00
Foreign References:
| JPH05335101A | 1993-12-17 | |||
| JPH09130052A | 1997-05-16 | |||
| JPH07336054A | 1995-12-22 |
Attorney, Agent or Firm:
Saito, Takehiko (1-18 Akasaka 1-chome, Minato-k, Tokyo 52, JP)
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