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Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/210261
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition that gives a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by curing the curable resin composition or the sealing material. The present invention further provides a camera module that includes the cured product.

Inventors:
ABE NOBUYUKI (JP)
MARUYAMA KAZUYUKI (JP)
Application Number:
PCT/JP2022/013960
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/18; C08G75/045; C08K3/013; C08K5/37; C08L63/00; C08L101/06; C09J4/02; C09J11/06; C09J163/00; G02B7/02; G03B11/04; G03B17/02
Domestic Patent References:
WO2022024838A12022-02-03
WO2008102550A12008-08-28
WO2017200082A12017-11-23
WO2016143815A12016-09-15
WO2016143777A12016-09-15
Foreign References:
JP2016138191A2016-08-04
JP2017101112A2017-06-08
JP2019077740A2019-05-23
JP2020147643A2020-09-17
JP2021075698A2021-05-20
JP2021075699A2021-05-20
JP2018203910A2018-12-27
JP2019091086A2019-06-13
JPH10275964A1998-10-13
JP2012153794A2012-08-16
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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