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Title:
LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/210262
Kind Code:
A1
Abstract:
This laminate comprises: a semiconductor substrate; a light-transmitting support substrate; and an adhesion layer and a release layer that are disposed between the semiconductor substrate and the support substrate. The release layer absorbs light having been emitted from the support substrate side, and then is used for releasing the semiconductor substrate and the support substrate from each other. The release layer is formed from a release agent composition. The release agent composition has a structure for absorbing the light, contributes to, by absorbing the light, an easy release of the semiconductor substrate and the support substrate from each other, and contains: a compound having at least one hydroxyl group; and an organosiloxane polymer.

Inventors:
MORIYA SHUNSUKE (JP)
OKUNO TAKAHISA (JP)
Application Number:
PCT/JP2022/013996
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
B32B27/00; B32B7/06; C09J7/35; C09J183/04; H01L21/02; H01L21/304
Domestic Patent References:
WO1997010193A11997-03-20
WO2000031183A12000-06-02
WO1998011149A11998-03-19
WO1991009081A11991-06-27
WO1994025903A11994-11-10
Foreign References:
JP2020122139A2020-08-13
JP2016072612A2016-05-09
JP2015151473A2015-08-24
JP2004064040A2004-02-26
JP2012106486A2012-06-07
JP2014150239A2014-08-21
EP0755957A11997-01-29
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JPH0228747B21990-06-26
JP5788173B22015-09-30
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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