Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/080226
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin composition that exhibits exceptional adhesive strength and creep properties even in a high-temperature environment. The aforementioned problem is solved by providing a curable resin composition containing a modified polyolefin A and a modified polyolefin B, wherein: the modified polyolefin A and the modified polyolefin B are resins obtained by grafting a moisture-curable functional group to a polyolefin a and a polyolefin b, respectively; the softening point of the polyolefin a ranges from 80°C to less than 120°C; the softening point of the polyolefin b is 120-170°C inclusive; and the content proportion of the modified polyolefin A and modified polyolefin B ranges from 50:50 to 95:5 in terms of mass ratio.
Inventors:
YOSHINO KENTO (JP)
SASAI TAMAYO (JP)
SASAI TAMAYO (JP)
Application Number:
PCT/JP2022/041292
Publication Date:
May 11, 2023
Filing Date:
November 07, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08F8/42; C08L51/06; C09J123/26; C09J151/06
Foreign References:
| JP2011518935A | 2011-06-30 | |||
| JP2004176028A | 2004-06-24 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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