Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/080227
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin composition that exhibits excellent adhesive strength and creep properties even in a high-temperature environment. The abovementioned problem is solved by providing a curable resin composition containing a modified polyolefin A and a polyolefin b, wherein: the modified polyolefin A is a resin in which a moisture-curable functional group is grafted to a polyolefin a; the softening point of the polyolefin a is 80°C or higher and lower than 120°C; the softening point of the polyolefin b is 120-170°C; and the content ratio of the modified polyolefin A to the polyolefin b is, in terms of mass ratio, the former:the latter = 50:50 to 95:5.
Inventors:
YOSHINO KENTO (JP)
SASAI TAMAYO (JP)
SASAI TAMAYO (JP)
Application Number:
PCT/JP2022/041293
Publication Date:
May 11, 2023
Filing Date:
November 07, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L51/06; C08F8/42; C08F255/00; C08L23/02; C09J123/26; C09J151/06
Domestic Patent References:
| WO2017047805A1 | 2017-03-23 | |||
| WO2021157467A1 | 2021-08-12 |
Foreign References:
| JP2004176028A | 2004-06-24 | |||
| JP2015533881A | 2015-11-26 | |||
| JP2011518935A | 2011-06-30 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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