CURABLE RESIN COMPOSITION

WIPO Patent Application WO/2023/286699

A1

The present invention addresses the problem of providing a UV-curable resin composition that provides a flexible cured product having a lower crosslinking density than conventional cured products. The present invention comprises the following (A) to (D): (A) a polyfunctional (meth)acrylate compound; (B) an adjusting agent containing the following (b1) and/or (b2): (b1) a monofunctional (meth)acrylate compound, and (b2) an epoxy resin having no reactive unsaturated double bond; (C) a polyfunctional thiol compound; and (D) a photo-radical initiator, wherein the total number (total amount) of (meth)acryloyloxy contained in the (A) polyfunctional (meth)acrylate compound, the total number (total amount) of (meth)acryloyloxy contained in the (B) adjusting agent, the total number (total amount) of epoxy groups contained in the (B) adjusting agent, and the total number (total amount) of thiol groups contained in the (C) polyfunctional thiol compound satisfy a predetermined relationship.

JPH02503207	[Title of the Invention] An adhesive promoter of a Thiolene adhesives combination thing
WO/2024/071132	METHOD FOR PRODUCING STRUCTURE
WO/2021/084603	RESIN COMPOSITION FOR WAVELENGTH CONVERSION, CURED RESIN MATERIAL FOR WAVELENGTH CONVERSION, WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE

OTSUBO KODAI (JP)
SUZUKI FUMIYA (JP)
SAKATA YOKO (JP)

PCT/JP2022/027059

January 19, 2023

July 08, 2022

Click for automatic bibliography generation  

NAMICS CORP (JP)

C08G75/045; C08G59/66; C09J4/02; C09J11/06; C09J163/00

WO2012147712A1	2012-11-01
WO2018155013A1	2018-08-30
WO2012164869A1	2012-12-06
WO2016114268A1	2016-07-21

JP2021075698A	2021-05-20
JP2017210475A	2017-11-30
JP2003302759A	2003-10-24
JP2014141621A	2014-08-07
JP2013043902A	2013-03-04

TSUKUNI & ASSOCIATES et al. (JP)

View/Download PDF      PDF Help

Previous Patent: ENCODING DEVICE AND METHOD, DECODING DEVICE AND METHOD, AND PROGRAM

Next Patent: CURABLE RESIN COMPOSITION