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Title:
CURABLE RESIN FILM, FIRST PROTECTIVE FILM FORMING SHEET, AND METHOD FOR PROTECTING BUMP FORMATION SURFACE
Document Type and Number:
WIPO Patent Application WO/2017/078037
Kind Code:
A1
Abstract:
Provided is a curable resin film for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to said surface and being cured. The curable resin film contains a (meth)acryloyl group, and the number of (meth)acryloyl groups per unit volume does not exceed 1.8×10-3 mol/cm3.

Inventors:
YAMAGISHI MASANORI (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2016/082510
Publication Date:
May 11, 2017
Filing Date:
November 02, 2016
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; H01L21/60
Foreign References:
JP2013023665A2013-02-04
JP2011204806A2011-10-13
JP2007266451A2007-10-11
JP2013194103A2013-09-30
JP2013074182A2013-04-22
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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