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Title:
CURABLE RESIN, AND METHODS FOR MANUFACTURING CURABLE RESIN INTERMEDIATE, CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/009612
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin that can provide a cured product having superior adhesion and thermal shock resistance, as well as a method for manufacturing an intermediate with which said curable resin can be synthesized, and a method for manufacturing said curable resin. A method for manufacturing a curable resin intermediate, said method including a step in which an epoxy resin with a polydispersity (Mw/Mn) of 2.8 or greater and an unsaturated monobasic acid are made to react in the presence of benzene or naphthalene, said benzene or naphthalene having two or more hydroxy groups directly bonded thereto.

Inventors:
OTSUKI NOBUAKI (JP)
MATSUDA YASUHIRO (JP)
Application Number:
PCT/JP2023/018148
Publication Date:
January 11, 2024
Filing Date:
May 15, 2023
Export Citation:
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Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
C08G59/16; C08F290/14
Domestic Patent References:
WO2021193878A12021-09-30
Foreign References:
JP2005141011A2005-06-02
JP2016145334A2016-08-12
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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