Title:
ELECTRICAL CIRCUIT BODY AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/009613
Kind Code:
A1
Abstract:
This electrical circuit body comprises: a semiconductor device in which a semiconductor element is sealed by a sealing material and embedded, and which has, on at least one surface thereof, a heat dissipating surface for dissipating heat from the semiconductor element; a cooling member that is disposed facing the heat dissipating surface of the semiconductor device and cools the semiconductor element; and a thermally conductive member disposed between the semiconductor device and the cooling member, wherein a terminal connecting to the semiconductor element protrudes beyond at least one side surface of the semiconductor device, and a first spacing between the sealing material and the cooling member on the one side surface of the semiconductor device from which the terminal protrudes is narrower than a second spacing between the sealing material and the cooling member on another side surface of the semiconductor device from which the terminal does not protrude.
Inventors:
TANG NING (JP)
TSUYUNO NOBUTAKE (JP)
KANEKO YUJIRO (JP)
TSUYUNO NOBUTAKE (JP)
KANEKO YUJIRO (JP)
Application Number:
PCT/JP2023/018181
Publication Date:
January 11, 2024
Filing Date:
May 15, 2023
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L23/29; H01L23/28; H01L23/36; H01L23/473; H01L25/07; H01L25/18
Domestic Patent References:
| WO2020245996A1 | 2020-12-10 |
Foreign References:
| JP2022092545A | 2022-06-22 | |||
| JP2021141275A | 2021-09-16 | |||
| JP2021048255A | 2021-03-25 | |||
| JP2020129601A | 2020-08-27 | |||
| JP2018088481A | 2018-06-07 | |||
| JP2017059606A | 2017-03-23 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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