Title:
CURABLE SILICONE COMPOSITION FOR USE WITH DISPENSER
Document Type and Number:
WIPO Patent Application WO/2019/004316
Kind Code:
A1
Abstract:
A curable silicone composition for use with a dispenser which is to be used by ejecting from a dispenser and then curing. The curable silicone composition for use with a dispenser comprises a reaction curing-type silicone, which serves as a matrix after curing, silica particles and a denatured silicone oil. According to the present invention, a curable silicone composition for use with a dispenser, whereby a dimensional change after ejection from the dispenser can be minimized, can be provided.
Inventors:
WAKASA AYAKA (JP)
Application Number:
PCT/JP2018/024457
Publication Date:
January 03, 2019
Filing Date:
June 27, 2018
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L83/05; C08K3/36; C08L83/04; C08L83/07
Foreign References:
| JP2014133796A | 2014-07-24 | |||
| JP2006342327A | 2006-12-21 | |||
| JP2015120888A | 2015-07-02 | |||
| JP2012230805A | 2012-11-22 | |||
| JP2002294910A | 2002-10-09 |
Other References:
See also references of EP 3647373A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF: