Title:
CURED FILM FORMATION COMPOSITION, ORIENTATION MATERIAL, AND PHASE DIFFERENCE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2013/054784
Kind Code:
A1
Abstract:
Provided are a cured film formation composition which forms a cured film of high photoreaction efficiency, solvent resistance, and adhesiveness, an orientation material for photo orientation, and a phase difference material formed by using the orientation material. The cured film formation composition of the present invention contains (A) a compound which contains a photo orientation group, and one substituent group selected among a hydroxyl group, a carboxyl group, and an amino group, (B) a hydrophilic polymer which contains one substituent group or two substituent groups selected among the hydroxyl group, the carboxyl group, and the amino group, and (C) a cross-linking agent which reacts to the (A) component and the (B) component, and reacts at a temperature lower than a sublimation temperature of the (A) component, further containing (E) an adhesion improvement component when the (B) component is an acrylic polymer. The cross-linking agent of the (C) component may be more hydrophilic than the (A) component. The cured film is formed by using the cured film formation composition, and an orientation material 10 is formed by using a photo orientation technology. A polymeric liquid crystal is applied onto the orientation material 10, and then cured to provide the phase difference material.
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Inventors:
HATANAKA TADASHI (JP)
ISHIDA TOMOHISA (JP)
YUKAWA SHOJIRO (JP)
ISHIDA TOMOHISA (JP)
YUKAWA SHOJIRO (JP)
Application Number:
PCT/JP2012/076101
Publication Date:
April 18, 2013
Filing Date:
October 09, 2012
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08L101/02; C08J7/043; C08J7/056; C08K5/23; G02B5/30
Domestic Patent References:
| WO2011010635A1 | 2011-01-27 | |||
| WO2011126022A1 | 2011-10-13 |
Foreign References:
| JP2007121721A | 2007-05-17 | |||
| JP2009109831A | 2009-05-21 | |||
| JPH10232365A | 1998-09-02 | |||
| JP2005049865A | 2005-02-24 | |||
| JP3611342B2 | 2005-01-19 | |||
| JP2009058584A | 2009-03-19 | |||
| JP2001517719A | 2001-10-09 | |||
| US6323310B1 | 2001-11-27 |
Other References:
See also references of EP 2767562A4
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
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Claims: