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Title:
CUTTING DEVICE, AND METHOD FOR MANUFACTURING CUT PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/201660
Kind Code:
A1
Abstract:
This cutting device configured so as to form a half cut groove in a cutting object comprises a table, a spindle part to which a blade is attached, a detection part, and a control part. The table holds the cutting object. The blade moves relative to the table while cutting the cutting object, and thereby forms a groove pattern constituted from half cut grooves in the cutting object. The detection part detects the height of the blade with respect to the table. The control part controls the position of the blade in the height direction. The control part causes the detection part to detect the height of the blade in accordance with the length of cutting of the cutting object by the blade while the blade is forming a groove pattern in a single cutting object, and corrects the position of the blade in the height direction when a the detected height does not satisfy a predetermined condition.

Inventors:
MOCHIZUKI HIROTO (JP)
ISONO SAORI (JP)
MIYATA KAZUSHI (JP)
ISHIBASHI KANJI (JP)
Application Number:
PCT/JP2021/045465
Publication Date:
September 29, 2022
Filing Date:
December 10, 2021
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
B24B27/06; B24B49/12; H01L21/301
Foreign References:
JP2019040899A2019-03-14
JP2016213240A2016-12-15
JP2003173986A2003-06-20
JP2006286694A2006-10-19
JP2008166546A2008-07-17
Attorney, Agent or Firm:
TACHIBANA, Kenji et al. (JP)
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