Title:
CUTTING DEVICE, CUTTING METHOD, AND METHOD OF MANUFACTURING LAMINATE OPTICAL MEMBER
Document Type and Number:
WIPO Patent Application WO/2014/125993
Kind Code:
A1
Abstract:
This cutting device is provided with a cutting unit which cuts a processing target, a first table which can move the processing target between a first position and a cutting position, and a second table which can move the processing target between the cutting position and a second position, which is opposite of the first position with respect to the cutting position, wherein the first position and the second position double as a loading position where, before cutting processing, the processing target is loaded from outside onto the first table or second table, and an unloading position where, after completing the cutting processing, the processing target is unloaded from the first table or the second table to the outside.
Inventors:
FUJII MIKIO (JP)
CHAE SUNGWOOK (JP)
CHAE SUNGWOOK (JP)
Application Number:
PCT/JP2014/052764
Publication Date:
August 21, 2014
Filing Date:
February 06, 2014
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
B23K26/38; B23K26/02; B23K26/40; B23K26/60; B23K26/70; B26D7/06; B26D7/18; G02B5/30; G02F1/13; G02F1/1335
Foreign References:
| JPS62199285U | 1987-12-18 | |||
| JPH1076330A | 1998-03-24 | |||
| JPH11267938A | 1999-10-05 | |||
| JP2005125339A | 2005-05-19 | |||
| JP2001047280A | 2001-02-20 | |||
| JPH1099985A | 1998-04-21 | |||
| JPH06315785A | 1994-11-15 | |||
| JPH11221634A | 1999-08-17 | |||
| JP2003107452A | 2003-04-09 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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