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Patent Searching and Data


Title:
CUTTING METHOD FOR TEMPERED GLASS
Document Type and Number:
WIPO Patent Application WO/2014/024931
Kind Code:
A1
Abstract:
This cutting method for tempered glass cuts tempered glass (G) with a scribe line (S) as a boundary after the scribe line (S) is formed along a planned cutting line from the front surface side on tempered glass (G) in which are formed a front surface side compressive stress layer (A1), which is present on a front surface (Ga) side in the direction of thickness and to which compressive stress is applied, a rear surface side compressive stress layer (A2), which is present on a rear surface (Gb) side and to which compressive stress is applied, and an intermediate tensile stress layer (B) present between the front surface side compressive stress layer (A1) and the rear surface side compressive stress layer (A2) and to which tensile stress is applied. When the scribe line (S) is formed, the thickness of the front surface side compressive stress layer (A1) is enhanced at least in the vicinity of a planned cutting line (X).

Inventors:
KONISHI TOMOMI (JP)
NAKATSU HIROYUKI (JP)
ICHIKAWA KOJI (JP)
KUNITOMO KAZUNOBU (JP)
TAKEUCHI HISAHIRO (JP)
AWAZU AKIRA (JP)
Application Number:
PCT/JP2013/071399
Publication Date:
February 13, 2014
Filing Date:
August 07, 2013
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03B33/02; C03B33/09
Foreign References:
JP2011230940A2011-11-17
JP2012061681A2012-03-29
JP2007191363A2007-08-02
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
Kunihiko Shiromura (JP)
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