Title:
POLISHING COMPOSITION, METHOD FOR PRODUCING SAID POLISHING COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE USING SAID POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/024930
Kind Code:
A1
Abstract:
A polishing composition comprises a water-soluble polymer that is a solid raw material, a dissolution inhibitor that serves to reduce the solubility of the water-soluble polymer in water, and water. In the polishing composition, a C/(A×B) value is 70 × 10-3 or less, wherein A represents the weight average molecular weight of the water-soluble polymer, B represents the content [% by mass] of the water-soluble polymer in the polishing composition, and C represents the content [ppm by mass] of the dissolution inhibitor in the polishing composition.
More Like This:
| JPS62291925 | CENTRIFUGAL DRYING DEVICE FOR SEMICONDUCTOR WAFER |
| JPS63202035 | MANUFACTURE OF SEMICONDUCTOR DEVICE |
| JPWO2014038310 | Manufacturing method of semiconductor element |
Inventors:
TAKAHASHI SHUHEI (JP)
MORI YOSHIO (JP)
TSUCHIYA KOHSUKE (JP)
MORI YOSHIO (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2013/071386
Publication Date:
February 13, 2014
Filing Date:
August 07, 2013
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304
Foreign References:
| JP2011181765A | 2011-09-15 | |||
| JP2008112969A | 2008-05-15 | |||
| JP2012135863A | 2012-07-19 |
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Makoto Onda (JP)
Makoto Onda (JP)
Download PDF:
Previous Patent: ENGINE DEVICE FOR MOUNTING ON WORKING MACHINE
Next Patent: CUTTING METHOD FOR TEMPERED GLASS
Next Patent: CUTTING METHOD FOR TEMPERED GLASS