Title:
DECOMPOSITION CLEANING COMPOSITION AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/120322
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a decomposition cleaning composition having a high etching rate, and a method for producing the same. The present invention pertains to a method that is for producing a decomposition cleaning composition and that is characterized by comprising: a mixing step for mixing a quaternary fluorinated alkylammonium or a hydrate thereof with, as aprotic solvents, (A) an N-substituted amide compound in which a hydrogen atom is not directly bonded to a nitrogen atom, and (B) an ether compound; an analysis step for accommodating a composition obtained in the mixing step in a quartz cell having an optical path length of 10 mm, and performing a spectral analysis on the composition; and a selection step for selecting a composition that has a UV absorbance of 1.40 or less with respect to a wavelength of 262 nm used in the measurement in the analysis step.
Inventors:
NAKAZAKI SUSUMU (JP)
HAYASHI KOTARO (JP)
HAYASHI KOTARO (JP)
Application Number:
PCT/JP2022/046034
Publication Date:
June 29, 2023
Filing Date:
December 14, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/304; C11D1/62; C11D3/20; C11D3/32; C11D3/43
Domestic Patent References:
| WO2021106460A1 | 2021-06-03 | |||
| WO2021205885A1 | 2021-10-14 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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