Title:
DEPOSITION APPARATUS AND DEPOSITION METHOD
Document Type and Number:
WIPO Patent Application WO/2012/053430
Kind Code:
A1
Abstract:
A technique is provided which is able to reduce waste of evaporated material due to standby time during deposition. In this deposition apparatus (1), a substrate loading and unloading region (6), a deposition region (7), and a standby region (8) are provided inside a vacuum chamber (2). A combined substrate (10) and mask mechanism (11) are transported between a deposition start position (21a) and the deposition region (7) by a substrate transport mechanism (21). A combined plurality of substrates (10) and mask mechanism (11) are transported between the substrate loading and unloading region (6) and the deposition start position (21a), and between the deposition start position (21a) and the standby region (8), respectively, by first and second substrate raising and lowering mechanisms (221, 222). The standby region (8) is provided in a position that does not overlap with the substrate transport mechanism (21).
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Inventors:
NAGATA JUNICHI (JP)
HANE KOUJI (JP)
HANE KOUJI (JP)
Application Number:
PCT/JP2011/073619
Publication Date:
April 26, 2012
Filing Date:
October 14, 2011
Export Citation:
Assignee:
ULVAC INC (JP)
NAGATA JUNICHI (JP)
HANE KOUJI (JP)
NAGATA JUNICHI (JP)
HANE KOUJI (JP)
International Classes:
C23C14/56; C23C14/24; H01L51/50; H05B33/10
Foreign References:
| JP2009224231A | 2009-10-01 | |||
| JP2007211270A | 2007-08-23 | |||
| JP2008303427A | 2008-12-18 | |||
| JPH11131232A | 1999-05-18 | |||
| JPH09279341A | 1997-10-28 | |||
| JP2006219760A | 2006-08-24 | |||
| JP2008231575A | 2008-10-02 |
Attorney, Agent or Firm:
ABE, Hideki et al. (JP)
Hideki Abe (JP)
Hideki Abe (JP)
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Claims: