Title:
DEPOSITION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2013/094707
Kind Code:
A1
Abstract:
The present invention relates to a deposition apparatus which comprises: a deposition source that evaporates a deposition material into a vacuum chamber; a substrate holder which opposes the deposition source and holds a substrate on a holding surface; and a deposition mask where a plurality of openings are formed side by side corresponding to a plurality of pattern formation regions set in advance on a surface of the substrate. The deposition apparatus forms the thin film pattern by depositing the deposition material evaporated from the deposition source onto the substrate through the openings in the deposition mask. The substrate holder is configured to include a built-in fixing unit which acts on an auxiliary fixing unit disposed in an edge region of the substrate to fix the substrate to the holding surface. Thereby, it is possible to prevent the substrate from becoming dislodged from the substrate holder even if there is an electrostatic adsorption failure.
Inventors:
KAJIYAMA KOICHI (JP)
MIZUMURA MICHINOBU (JP)
IWAMOTO TAKAMITSU (JP)
KUDO SYUJI (JP)
MIZUMURA MICHINOBU (JP)
IWAMOTO TAKAMITSU (JP)
KUDO SYUJI (JP)
Application Number:
PCT/JP2012/083147
Publication Date:
June 27, 2013
Filing Date:
December 20, 2012
Export Citation:
Assignee:
V TECHNOLOGY CO LTD (JP)
International Classes:
C23C14/24; C23C14/50; H01L21/683
Foreign References:
| JP2006156905A | 2006-06-15 | |||
| JPS58126978A | 1983-07-28 | |||
| JP2006057183A | 2006-03-02 | |||
| JP2010261081A | 2010-11-18 |
Attorney, Agent or Firm:
SASAJIMA, Fujio et al. (JP)
Sasajima Wealth 2 male (JP)
Sasajima Wealth 2 male (JP)
Download PDF:
Claims: