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Patent Searching and Data


Title:
DEVICE FOR DETECTING FILM THICKNESS
Document Type and Number:
WIPO Patent Application WO/2017/201932
Kind Code:
A1
Abstract:
A device for detecting a film thickness, comprising a common unit (1) and a detection unit (2). The common unit (1) comprises at least one common electrode (11), and the detection unit (2) comprises at least one sensor chip (21) and signal processing unit (23). Each of the sensor chips (21) is opposite to and spaced apart from the common unit (1) in a first direction.The spaces between the common unit (1) and the sensor chips (21) form a transport channel of a film under test. The sensor chips (21) comprise at least one row of multiple detection electrodes (211) arranged in a second direction. The second direction is perpendicular to a moving direction of the film under test. The first direction is perpendicular to a first plane, and the first plane is parallel to the second direction. The sensor chips (21) are used to sense and output an electrical signal of the common electrode (11). The signal processing unit (23) is electrically connected to the sensor chips (21), and processes and outputs an electrical signal outputted by the sensor chips (21).

Inventors:
QI WUCHANG (CN)
Application Number:
PCT/CN2016/099938
Publication Date:
November 30, 2017
Filing Date:
September 23, 2016
Export Citation:
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Assignee:
WEIHAI HUALING OPTO-ELECTRONICS CO LTD (CN)
International Classes:
G01B7/06
Foreign References:
CN105136011A2015-12-09
CN205102770U2016-03-23
CN101754919A2010-06-23
EP1148315A22001-10-24
US5760589A1998-06-02
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
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